Table of Contents
Historical Data, Premium Insights, Market Dynamic, Analysis and Projection, By Product, Analysis and Projection, By Application, Analysis and Projection, By End-Use, Analysis and Projection, By Regional Analysis, Competitive Landscape, Company Profiles, Market Revenue, Sale & Price Analysis
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According to a research report published by Spherical Insights & Consulting, The Global Advanced Packaging Market Size is Expected to Grow from USD 47.8 Billion in 2023 to USD 128.5 Billion by 2033, at a CAGR of 10.39% during the forecast period 2023-2033.
Browse key industry insights spread across 210 pages with 110 Market data tables and figures & charts from the report on the Global Advanced Packaging Market Size, Share, and COVID-19 Impact Analysis, By Packaging Type (Flip Chip Scale Package, Flip Chip Ball Grid Array, Wafer Level Chip Scale Packaging, 5D/3D, Fan Out Wafer-Level Packaging, and Others), By End-User (Consumer Electronics, Healthcare, Industrial, Aerospace & Defense, Automotive, and Others), and By Region (North America, Europe, Asia-Pacific, Latin America, Middle East, and Africa), Analysis and Forecast 2023 – 2033.
Advanced packaging market is characterized by the development and manufacturing of packaging solutions for electronic devices. Advanced packaging is a technique that combines multiple components into a single electronic device, used to make chips more powerful, faster, and more energy efficient. Unlike traditional integrated circuit packaging, advanced packaging employs processes and techniques at semiconductor fabrication facilities. The packaging also involves grouping distinct techniques including 2.5D, 3D-IC, fan-out-wafer-level packaging, and system-in-package. The adoption of this technology owing to various factors such as elimination of wafer bumping, elimination of flip-chip reflows, better wafer-level yield, and easier adoption of system-in-package and 3D integrated circuits packaging are offering lucrative market growth opportunities. The increasing adoption of advanced packaging in the automotive and healthcare sectors is driving the advanced packaging market. In addition, the growing investment in semiconductor manufacturing facilities as well as the emphasis on sustainability and energy-efficient solutions are propelling the market growth. On the contrary, the increased cost of advanced packaging as compared to conventional packaging solutions in the semiconductor industry is challenging the market growth.
The flip chip ball grid array segment held the largest market share and is expected to grow at a significant CAGR during the predicted timeframe.
Based on the packaging type, the global advanced packaging market is divided into flip chip scale package, flip chip ball grid array, wafer level chip scale packaging, 5D/3D, fan out wafer-level packaging, and others. Among these, the flip chip ball grid array segment held the largest market share and is expected to grow at a significant CAGR during the predicted timeframe. This type of packaging is preferably used for many high-performance applications, especially in the field of graphics acceleration chips. The increasing demand for cutting-edge chip packaging techniques is driving the market growth in the flip chip ball grid array type segment.
The consumer electronics segment holds the largest share and is anticipated to grow at the fastest CAGR growth during the forecast period.
Based on the end-user, the global advanced packaging market is divided into consumer electronics, healthcare, industrial, aerospace & defense, automotive, and others. Among these, the consumer electronics segment holds the largest share and is anticipated to grow at the fastest CAGR growth during the forecast period. Advanced packaging in consumer electronics makes devices smaller, more powerful, and more energy efficient. The rapidly growing electronic sector along with the escalating need for various consumer electronics including wearables, desktops, smartphones, laptops, and miniaturized devices is driving the market.
Asia Pacific is projected to hold the largest share of the global advanced packaging market over the forecast period.
Asia Pacific is projected to hold the largest share of the global advanced packaging market over the forecast period. The increased need for compact electronic devices is expected to drive the market for advanced packaging. The region's leadership in 5G deployment contributes to driving advanced processors, thereby propelling the regional market growth. Further, the rising investment in high-end packaging boosts domestic semiconductor manufacturing contributing to propel the market growth.
North America is predicted to grow at the fastest CAGR in the advanced packaging market over the forecast period. The necessity for technological platforms and sophisticated, smart equipment across several industries has increased the adoption of creative packaging solutions which is propelling the advanced packaging market. The region’s stringent quality standards propelling the demand for high-reliability advanced packaging in aerospace and defense applications, thereby driving the market growth.
Company Profiling
Major key players in the advanced packaging market include Analog Devices, Intel Corporation., Texas Instruments Inc., Microchip Technology, TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED, Amkor Technology Inc., Renesas Electronics Corporation, IBM Corporation, Qualcomm Technologies Inc., and Others.
Key Target Audience
Recent Developments
Market Segment
This study forecasts revenue at global, regional, and country levels from 2023 to 2033. Spherical Insights has segmented the global advanced packaging market based on the below-mentioned segments:
Global Advanced Packaging Market, By Packaging Type
Global Advanced Packaging Market, By End-User
Global Advanced Packaging Market, Regional Analysis
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