Global Chemical Mechanical Polishing Market Insights Forecasts to 2033

• The Global Chemical Mechanical Polishing Market Size was Valued at USD 6.70 Billion in 2023
• The Market Size is Growing at a CAGR of 7.23% from 2023 to 2033
• The Worldwide Chemical Mechanical Polishing Size is Expected to Reach USD 13.47 Billion by 2033
• North America is Expected to Grow the fastest during the forecast period.

The Global Chemical Mechanical Polishing Market Size is Anticipated to Exceed USD 13.47 Billion by 2033, Growing at a CAGR of 7.23% from 2023 to 2033.

Market Overview:

Chemical mechanical polishing (CMP) is a production technique that utilizes an amalgamation of chemical oxidation and mechanical erosion to eradicate material and make smooth, planar surfaces. The growing technological advancement in fabrication and semiconductor developments has significantly impacted to growth of the market. For instance, according to the Press Information Bureau, the Indian semiconductor business was valued at around $ 38 billion in 2023 and is forecast to grow to $ 109 billion by 2030. The government has taken numerous initiatives to augment the indigenous production of semiconductors in the country. The government's taking such initiative will ultimately boost the financial growth in the nation which will aid to support the growth of the market. The growing use of these components in the IoT, automotive, and 5G industries might additionally increase demand for CMP machinery and services throughout the projection period. The chemical mechanical polishing technique has played an important part in the production of transistors and other interconnect devices for the next generation of processors. Such factors are projected to drive market growth throughout the forecast. The TB-QCMD method-based CMP simulator is a trustworthy tool for understanding chemically controlled CMP processes, leading to market growth.

Report Coverage:

This research report categorizes the market for the global chemical mechanical polishing market based on various segments and regions forecasts revenue growth and analyses trends in each submarket. The report analyses the key growth drivers, opportunities, and challenges influencing the global chemical mechanical polishing market. Recent market developments and competitive strategies such as expansion, product launch, and development, partnership, merger, and acquisition have been included to draw the competitive landscape in the market. The report strategically identifies and profiles the key market players and analyses their core competencies in each sub-segment of the global chemical mechanical polishing market.

Driving Factors:

The demand for compact electronic devices is expected to increase across all economic sectors, forcing semiconductor IC producers to broaden their scientific and technological processes to decrease IC size and enhance efficiency, resulting in the development of micro-electro-mechanical systems (MEMS) and 3D chip packaging. These factors boost the market need for chemical mechanical polishing. The function of IC packaging has evolved into an important aspect in the development of electronic systems, boosting the market for CMP.

Restraining Factors:

CMP-induced flaws caused by impurities found on wafer surfaces result in device failure and significant yield loss. It has become a major worry in the contemporary semiconductor production process, limiting the chemical mechanical polishing business.

Market Segmentation:

The global chemical mechanical polishing market share is classified into type and application.

• The CMP consumable segment is expected to drive market growth during the forecast period.

Based on the type, the global chemical mechanical polishing market is categorized into CMP equipment and CMP consumables. Among these, the CMP consumable segment is expected to drive market growth during the forecast period. CMP consumables play an important role in the production of modern semiconductor devices. It helps to enable the production of smaller, quicker, and more complicated gadgets for end users. The worldwide market for CMP slurry is predicted to develop considerably during the forecast period due to increased technical improvements in semiconductor production processes, which seek to improve semiconductor performance. Furthermore, in response to the tremendous demand for the CMP process, suppliers and manufacturers are using a variety of methods, including new product development and mergers and acquisitions, to handle the expanding market rivalry. It is projected to drive growth in the CMP consumables segment growth.

• The integrated circuits segment has the largest share of the market over the forecast period.

Based on the application, the global chemical mechanical polishing market is categorized into integrated circuits, semiconductors, MEMS/NEMS, and others. Among these, the integrated circuits segment has the largest share of the market over the forecast period. The developments in IC technology are projected to pave the door for new types of equipment, including polishing equipment. However, Integrated Device Technology Inc., a wholly owned subsidiary of Renesas Electronics Corporation, released its first integrated power management integrated circuit (PMIC). It was designed for tiny outlines and unbuffered DDR5-based dual in-line memory modules, and it made substantial adjustments to the spectrum of laptops, desktops, and embedded computing platforms. Similar improvements are projected to propel the IC industry forward.

Regional Segment Analysis of the Global Chemical Mechanical Polishing Market

• North America (U.S., Canada, Mexico) 
• Europe (Germany, France, U.K., Italy, Spain, Rest of Europe)
• Asia-Pacific (China, Japan, India, Rest of APAC)
• South America (Brazil and the Rest of South America) 
• The Middle East and Africa (UAE, South Africa, Rest of MEA)

Asia-Pacific is projected to hold the largest share of the global chemical mechanical polishing market over the forecast period.

Asia-Pacific is projected to hold the largest share of the global chemical mechanical polishing market over the forecast period. China held the largest market share due to higher expenditures in building new semiconductor plants, as well as growing demand from various end-use industries such as mobile phones, computers, and others, which are significant variables operating the growth of electronic components, integrated circuits, and other electrical devices. The rising upgradation in the telecom sector due to 5G and in the automobile industry is also fueling the company's product demand, expanding the market for suppliers. Taiwan-based TSMC is one of the world's top contract chipmakers and has an important role in driving demand for CMP slurries.

North America region is also expected to fastest CAGR growth during the forecast period. This is owing to the North American region's increased production activity in electrical products such as semiconductors, integrated circuits, MEMS, and NEMS, among others. The growing use of sophisticated fabrication processes in the semiconductor sector is propelling the US market. CMP has become a prominent manufacturing technology throughout the United States.

Competitive Analysis:

The report offers the appropriate analysis of the key organizations/companies involved within the global chemical mechanical polishing market along with a comparative evaluation primarily based on their product offering, business overviews, geographic presence, enterprise strategies, segment market share, and SWOT analysis. The report also provides an elaborative analysis focusing on the current news and developments of the companies, which includes product development, innovations, joint ventures, partnerships, mergers & acquisitions, strategic alliances, and others. This allows for the evaluation of the overall competition within the market.

List of Key Companies:

• Ebara Corporation
• Applied Materials Inc
• Cabot Microelectronics Corporation
• Lapmaster Wolters GmbH
• Fujimi Incorporated
• CMC Materials Inc
• Hitachi Chemical Company Ltd
• Badische Anilin- und Sodafabrik SE
• Samsung Electronics Co. Ltd
• Revasum Inc
• Versum Materials Inc
• Evonik Industries AG
• Asahi Glass Corporation
• DuPont de Nemours Inc
• Ferro Corporation
• 3A Composites India Private Limited
• HKC Vietnam Company Limited
• Others

Key Market Developments:

• In January 2024, Fujifilm, a Japanese company, constructed a new facility to produce Chemical Mechanical Polishing (CMP) slurries, which are utilized in the semiconductor manufacturing process.

Key Target Audience

• Market Players
• Investors
• End-users
• Government Authorities 
• Consulting And Research Firm
• Venture capitalists
• Value-Added Resellers (VARs)  

Market Segment

This study forecasts revenue at global, regional, and country levels from 2020 to 2033. Spherical Insights has segmented the global chemical mechanical polishing market based on the below-mentioned segments: 

Global Chemical Mechanical Polishing Market, By Type

• CMP Equipment
• CMP Consumable

Global Chemical Mechanical Polishing Market, By Application

• Integrated Circuits
• Semiconductors
• MEMS/NEMS
• Others

Global Chemical Mechanical Polishing Market, By Regional

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • Uk
  • France
  • Italy
  • Spain
  • Russia
  • Rest of Europe
• Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Rest of Asia Pacific
• South America
  • Brazil
  • Argentina
  • Rest of South America
• Middle East & Africa
  • UAE
  • Saudi Arabia
  • Qatar
  • South Africa
  • Rest of the Middle East & Africa